Socket to Me?

[teenix]

(09-28-2021 04:32 AM)Garth Wilson Wrote:  If the holes are plated through, the pads are like the flanges of a rivet, so delamination should not be a problem. It is very difficult to remove an IC from thru-plated holes though.

Sometimes, especially on older boards, the actual via can stick to the IC pin and can pull out of the PCB hole. This is fixable though, just by soldering the new pin on both sides of the board.

I have an electric de-solder pump and before use I usually re-solder the joints (especially if old) to build up some solder on them. This allows better heat transfer for the de-solder iron and also helps to draw the solder from the PCB hole during suction.

A lot of times, the ICs are originally soldered such that the pins are pressing against the side of the via. Even after sucking out the molten solder, some stays and solidifies between the pin and via wall which is why they are hard to remove, or damaging to the PCB if you exert too much pressure trying to remove the stuck pin.

I take note of this and once the solder has melted, I use the soldering iron tip to push the pin sideways to the opposite side of the hole and then suck the solder out. Usually the pin will spring back a little and remain in the center of the hole without solder contact.

cheers

Tony